MC68020FE25
vs
NG80L960JF-25
feature comparison
Rohs Code |
No
|
No
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
MOTOROLA INC
|
INTEL CORP
|
Package Description |
QFP, QFP132,1.2SQ
|
BQFP, SPQFP132,1.1SQ
|
Reach Compliance Code |
unknown
|
unknown
|
HTS Code |
8542.31.00.01
|
8542.31.00.01
|
Additional Feature |
DYNAMIC BUS SIZING; 3 PIPELINE STAGES
|
OPERATING CASE TEMPERATURE 0 TO 100
|
Address Bus Width |
32
|
32
|
Bit Size |
32
|
32
|
Boundary Scan |
NO
|
YES
|
Clock Frequency-Max |
25 MHz
|
25 MHz
|
External Data Bus Width |
32
|
32
|
Format |
FIXED POINT
|
FIXED POINT
|
Integrated Cache |
YES
|
NO
|
JESD-30 Code |
S-CQFP-G132
|
S-PQFP-G132
|
JESD-609 Code |
e0
|
e0
|
Length |
22.355 mm
|
24.13 mm
|
Low Power Mode |
NO
|
YES
|
Number of DMA Channels |
|
|
Number of External Interrupts |
8
|
9
|
Number of Serial I/Os |
|
|
Number of Terminals |
132
|
132
|
On Chip Data RAM Width |
|
8
|
Operating Temperature-Max |
70 °C
|
100 °C
|
Operating Temperature-Min |
|
|
Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
PLASTIC/EPOXY
|
Package Code |
QFP
|
BQFP
|
Package Equivalence Code |
QFP132,1.2SQ
|
SPQFP132,1.1SQ
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
FLATPACK
|
FLATPACK, BUMPER
|
Qualification Status |
Not Qualified
|
Not Qualified
|
RAM (words) |
0
|
512
|
Seated Height-Max |
4.31 mm
|
4.57 mm
|
Speed |
25 MHz
|
25 MHz
|
Supply Voltage-Max |
5.25 V
|
3.6 V
|
Supply Voltage-Min |
4.75 V
|
3 V
|
Supply Voltage-Nom |
5 V
|
3.3 V
|
Surface Mount |
YES
|
YES
|
Technology |
HCMOS
|
CMOS
|
Temperature Grade |
COMMERCIAL
|
OTHER
|
Terminal Finish |
TIN LEAD
|
TIN LEAD
|
Terminal Form |
GULL WING
|
GULL WING
|
Terminal Pitch |
0.635 mm
|
0.635 mm
|
Terminal Position |
QUAD
|
QUAD
|
Width |
22.355 mm
|
24.13 mm
|
uPs/uCs/Peripheral ICs Type |
MICROPROCESSOR
|
MICROPROCESSOR, RISC
|
Base Number Matches |
2
|
1
|
Part Package Code |
|
QFP
|
Pin Count |
|
132
|
Supply Current-Max |
|
284 mA
|
|
|
|
Compare MC68020FE25 with alternatives
Compare NG80L960JF-25 with alternatives