MC68010R12
vs
MC68000CR12
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
MOTOROLA SEMICONDUCTOR PRODUCTS
MOTOROLA INC
Package Description
PGA, PGA68,10X10
DIP, PGA68,10X10
Reach Compliance Code
unknown
unknown
Bit Size
32
32
JESD-30 Code
S-XPGA-P68
R-PDIP-T64
JESD-609 Code
e0
e0
Number of Terminals
68
64
Operating Temperature-Max
70 °C
85 °C
Operating Temperature-Min
-40 °C
Package Body Material
CERAMIC
PLASTIC/EPOXY
Package Code
PGA
DIP
Package Equivalence Code
PGA68,10X10
PGA68,10X10
Package Shape
SQUARE
RECTANGULAR
Package Style
GRID ARRAY
IN-LINE
Qualification Status
Not Qualified
Not Qualified
Speed
12.5 MHz
12 MHz
Surface Mount
NO
NO
Technology
MOS
CMOS
Temperature Grade
COMMERCIAL
INDUSTRIAL
Terminal Finish
Tin/Lead (Sn/Pb)
TIN LEAD
Terminal Form
PIN/PEG
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
PERPENDICULAR
DUAL
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR, RISC
MICROPROCESSOR
Base Number Matches
3
3
Part Package Code
DIP
Pin Count
64
HTS Code
8542.31.00.01
Address Bus Width
24
Boundary Scan
NO
Clock Frequency-Max
12 MHz
External Data Bus Width
16
Format
FIXED POINT
Integrated Cache
NO
Length
81.535 mm
Low Power Mode
NO
Number of DMA Channels
Number of External Interrupts
7
Number of Serial I/Os
On Chip Data RAM Width
RAM (words)
0
Seated Height-Max
5.84 mm
Supply Current-Max
35 mA
Supply Voltage-Max
5.25 V
Supply Voltage-Min
4.75 V
Supply Voltage-Nom
5 V
Width
22.86 mm
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