MC68000CR8
vs
MC68HC000R8
feature comparison
All Stats
Differences Only
Rohs Code
No
No
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
MOTOROLA INC
MOTOROLA INC
Part Package Code
DIP
DIP
Package Description
DIP, PGA68,10X10
DIP, PGA68,10X10
Pin Count
64
64
Reach Compliance Code
unknown
unknown
HTS Code
8542.31.00.01
8542.31.00.01
Address Bus Width
24
24
Bit Size
32
32
Boundary Scan
NO
NO
Clock Frequency-Max
8 MHz
8 MHz
External Data Bus Width
16
16
Format
FIXED POINT
FIXED POINT
Integrated Cache
NO
NO
JESD-30 Code
R-PDIP-T64
R-PDIP-T64
JESD-609 Code
e0
e0
Length
81.535 mm
81.535 mm
Low Power Mode
NO
NO
Number of DMA Channels
Number of External Interrupts
7
7
Number of Serial I/Os
Number of Terminals
64
64
On Chip Data RAM Width
Operating Temperature-Max
85 °C
70 °C
Operating Temperature-Min
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
DIP
DIP
Package Equivalence Code
PGA68,10X10
PGA68,10X10
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Qualification Status
Not Qualified
Not Qualified
RAM (words)
0
0
Seated Height-Max
5.84 mm
5.84 mm
Speed
8 MHz
8 MHz
Supply Current-Max
25 mA
25 mA
Supply Voltage-Max
5.25 V
5.25 V
Supply Voltage-Min
4.75 V
4.75 V
Supply Voltage-Nom
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
COMMERCIAL
Terminal Finish
TIN LEAD
TIN LEAD
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Width
22.86 mm
22.86 mm
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR
MICROPROCESSOR
Base Number Matches
3
3
Compare MC68000CR8 with alternatives
Compare MC68HC000R8 with alternatives