MC68000CR8
vs
MC68010R8
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
MOTOROLA SEMICONDUCTOR PRODUCTS
MOTOROLA INC
Package Description
PGA, PGA68,10X10
PLASTIC, DIP-64
Reach Compliance Code
unknown
unknown
Bit Size
32
32
JESD-30 Code
S-XPGA-P68
R-PDIP-T64
JESD-609 Code
e0
e0
Number of Terminals
68
64
Operating Temperature-Max
85 °C
70 °C
Operating Temperature-Min
-40 °C
Package Body Material
CERAMIC
PLASTIC/EPOXY
Package Code
PGA
DIP
Package Equivalence Code
PGA68,10X10
PGA68,10X10
Package Shape
SQUARE
RECTANGULAR
Package Style
GRID ARRAY
IN-LINE
Power Supplies
5 V
Qualification Status
Not Qualified
Not Qualified
Speed
8 MHz
8 MHz
Supply Voltage-Nom
5 V
5 V
Surface Mount
NO
NO
Technology
MOS
CMOS
Temperature Grade
INDUSTRIAL
COMMERCIAL
Terminal Finish
Tin/Lead (Sn/Pb)
TIN LEAD
Terminal Form
PIN/PEG
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
PERPENDICULAR
DUAL
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR, RISC
MICROPROCESSOR
Base Number Matches
3
3
HTS Code
8542.31.00.01
Address Bus Width
24
Boundary Scan
NO
Clock Frequency-Max
8 MHz
External Data Bus Width
16
Format
FIXED POINT
Integrated Cache
NO
Length
81.535 mm
Low Power Mode
NO
Number of DMA Channels
Number of External Interrupts
7
Number of Serial I/Os
On Chip Data RAM Width
RAM (words)
0
Seated Height-Max
5.84 mm
Supply Current-Max
25 mA
Supply Voltage-Max
5.25 V
Supply Voltage-Min
4.75 V
Width
22.86 mm
Compare MC68010R8 with alternatives