MC54HC4066J
vs
933669110652
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
MOTOROLA SEMICONDUCTOR PRODUCTS
NXP SEMICONDUCTORS
Package Description
DIP, DIP14,.3
DIP,
Reach Compliance Code
unknown
unknown
Analog IC - Other Type
SPST
SPST
JESD-30 Code
R-XDIP-T14
R-PDIP-T14
JESD-609 Code
e0
e4
Normal Position
NO
Number of Functions
4
4
Number of Terminals
14
14
On-state Resistance-Max (Ron)
255 Ω
95 Ω
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-40 °C
Output
SEPARATE OUTPUT
Package Body Material
CERAMIC
PLASTIC/EPOXY
Package Code
DIP
DIP
Package Equivalence Code
DIP14,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Power Supplies
2/12 V
Qualification Status
Not Qualified
Not Qualified
Surface Mount
NO
NO
Switch-on Time-Max
150 ns
20 ns
Switching
MAKE-BEFORE-BREAK
Technology
CMOS
CMOS
Temperature Grade
MILITARY
AUTOMOTIVE
Terminal Finish
Tin/Lead (Sn/Pb)
Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Base Number Matches
5
1
Pbfree Code
Part Package Code
DIP
Pin Count
14
HTS Code
8542.39.00.01
Length
19.025 mm
Number of Channels
1
Off-state Isolation-Nom
50 dB
On-state Resistance Match-Nom
5 Ω
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Seated Height-Max
4.2 mm
Supply Voltage-Max (Vsup)
10 V
Supply Voltage-Min (Vsup)
2 V
Supply Voltage-Nom (Vsup)
4.5 V
Switch-off Time-Max
30 ns
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Width
7.62 mm
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