MC54F08J
vs
SN74HC11J4
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Active
Ihs Manufacturer
MOTOROLA INC
ROCHESTER ELECTRONICS LLC
Part Package Code
DIP
Package Description
DIP, DIP14,.3
,
Pin Count
14
Reach Compliance Code
unknown
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Family
F/FAST
HC
JESD-30 Code
R-GDIP-T14
R-GDIP-T14
JESD-609 Code
e0
Length
19.495 mm
19.56 mm
Load Capacitance (CL)
50 pF
Logic IC Type
AND GATE
AND GATE
Max I(ol)
0.02 A
0.0052 A
Number of Functions
4
3
Number of Inputs
2
3
Number of Terminals
14
14
Operating Temperature-Max
125 °C
85 °C
Operating Temperature-Min
-55 °C
-40 °C
Package Body Material
CERAMIC, GLASS-SEALED
CERAMIC, GLASS-SEALED
Package Code
DIP
DIP
Package Equivalence Code
DIP14,.3
DIP14,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Power Supply Current-Max (ICC)
12.9 mA
0.02 mA
Prop. Delay@Nom-Sup
7.5 ns
125 ns
Propagation Delay (tpd)
7.5 ns
125 ns
Qualification Status
Not Qualified
Schmitt Trigger
NO
NO
Seated Height-Max
5.08 mm
5.08 mm
Supply Voltage-Max (Vsup)
5.5 V
6 V
Supply Voltage-Min (Vsup)
4.5 V
2 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
TTL
CMOS
Temperature Grade
MILITARY
Terminal Finish
TIN LEAD
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Width
7.62 mm
7.62 mm
Base Number Matches
2
1
Compare MC54F08J with alternatives
Compare SN74HC11J4 with alternatives