MC34152DR2G
vs
MC33152PG
feature comparison
| Pbfree Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
ONSEMI
|
ONSEMI
|
| Part Package Code |
SOIC-8 Narrow Body
|
8 LEAD PDIP
|
| Package Description |
SOIC-8
|
DIP-8
|
| Pin Count |
8
|
8
|
| Manufacturer Package Code |
751-07
|
626-05
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Factory Lead Time |
12 Weeks
|
11 Weeks, 4 Days
|
| Samacsys Manufacturer |
onsemi
|
onsemi
|
| High Side Driver |
YES
|
YES
|
| Interface IC Type |
BUFFER OR INVERTER BASED MOSFET DRIVER
|
BUFFER OR INVERTER BASED MOSFET DRIVER
|
| JESD-30 Code |
R-PDSO-G8
|
R-PDIP-T8
|
| JESD-609 Code |
e3
|
e3
|
| Length |
4.9 mm
|
9.78 mm
|
| Moisture Sensitivity Level |
1
|
|
| Number of Functions |
2
|
2
|
| Number of Terminals |
8
|
8
|
| Operating Temperature-Max |
70 °C
|
85 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| Output Peak Current Limit-Nom |
1.5 A
|
1.5 A
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
SOP
|
DIP
|
| Package Equivalence Code |
SOP8,.25
|
DIP8,.3
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE
|
IN-LINE
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.75 mm
|
4.45 mm
|
| Supply Voltage-Max |
18 V
|
18 V
|
| Supply Voltage-Min |
6.5 V
|
6.5 V
|
| Supply Voltage-Nom |
12 V
|
12 V
|
| Surface Mount |
YES
|
NO
|
| Technology |
BIPOLAR
|
BIPOLAR
|
| Temperature Grade |
COMMERCIAL
|
INDUSTRIAL
|
| Terminal Finish |
MATTE TIN
|
MATTE TIN
|
| Terminal Form |
GULL WING
|
THROUGH-HOLE
|
| Terminal Pitch |
1.27 mm
|
2.54 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
|
| Turn-off Time |
0.12 µs
|
0.12 µs
|
| Turn-on Time |
0.12 µs
|
0.12 µs
|
| Width |
3.9 mm
|
7.62 mm
|
| Base Number Matches |
1
|
1
|
|
|
|
Compare MC34152DR2G with alternatives
Compare MC33152PG with alternatives