MC33993DWB vs MC33993DWBR2 feature comparison

MC33993DWB Freescale Semiconductor

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MC33993DWBR2 Motorola Mobility LLC

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Pbfree Code No
Rohs Code No
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer FREESCALE SEMICONDUCTOR INC MOTOROLA INC
Part Package Code SOIC SOIC
Package Description SSOP, SSOP,
Pin Count 32 32
Reach Compliance Code compliant unknown
ECCN Code EAR99
HTS Code 8542.31.00.01 8542.39.00.01
Samacsys Manufacturer NXP
Interface IC Type INTERFACE CIRCUIT INTERFACE CIRCUIT
JESD-30 Code R-PDSO-G32 R-PDSO-G32
JESD-609 Code e0
Length 11 mm 11 mm
Moisture Sensitivity Level 1
Number of Functions 1 1
Number of Terminals 32 32
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SSOP SSOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, SHRINK PITCH SMALL OUTLINE, SHRINK PITCH
Peak Reflow Temperature (Cel) 220
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.65 mm 2.65 mm
Supply Voltage-Max 5.25 V 5.25 V
Supply Voltage-Min 3.1 V 3.1 V
Supply Voltage-Nom 3.3 V
Supply Voltage1-Max 26 V 26 V
Supply Voltage1-Min 8 V 8 V
Supply Voltage1-Nom 13 V 13 V
Surface Mount YES YES
Temperature Grade AUTOMOTIVE AUTOMOTIVE
Terminal Finish Tin/Lead (Sn/Pb)
Terminal Form GULL WING GULL WING
Terminal Pitch 0.65 mm 0.65 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30
Width 7.5 mm 7.5 mm
Base Number Matches 3 1

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