MC33882VW
vs
MC33882PVW
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
FREESCALE SEMICONDUCTOR INC
NXP SEMICONDUCTORS
Part Package Code
SOIC
Package Description
LEAD FREE, PLASTIC, HSOP-30
ROHS COMPLIANT, HSOP-30
Pin Count
30
Reach Compliance Code
not_compliant
not_compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.39.00.01
8542.39.00.01
Built-in Protections
OVER CURRENT; OVER VOLTAGE; UNDER VOLTAGE; TRANSIENT
TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE
Interface IC Type
BUFFER OR INVERTER BASED PERIPHERAL DRIVER
BUFFER OR INVERTER BASED PERIPHERAL DRIVER
JESD-30 Code
R-PDSO-G30
R-PDSO-G30
Length
15.9 mm
15.9 mm
Moisture Sensitivity Level
3
3
Number of Functions
1
1
Number of Terminals
30
30
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-40 °C
-40 °C
Output Current Flow Direction
SINK
SINK
Output Peak Current Limit-Nom
1 A
3 A
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
HSSOP
HSSOP
Package Equivalence Code
SOP30,.57,32
SOP30,.57,32
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH
SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH
Peak Reflow Temperature (Cel)
245
245
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
3.404 mm
3.4 mm
Supply Voltage-Max
5.25 V
5.5 V
Supply Voltage-Min
4.75 V
4.5 V
Supply Voltage-Nom
5 V
5 V
Supply Voltage1-Max
25 V
25 V
Supply Voltage1-Min
8 V
8 V
Supply Voltage1-Nom
13 V
13 V
Surface Mount
YES
YES
Technology
BCDMOS
MOS
Temperature Grade
AUTOMOTIVE
AUTOMOTIVE
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.8 mm
0.8 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
30
30
Turn-off Time
10 µs
10 µs
Turn-on Time
10 µs
10 µs
Width
11 mm
11 mm
Base Number Matches
1
2
Samacsys Manufacturer
NXP
Driver Number of Bits
8
Compare MC33882VW with alternatives
Compare MC33882PVW with alternatives