MC33879EKR2
vs
MC33879TEKR2
feature comparison
All Stats
Differences Only
Rohs Code
Yes
Yes
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
FREESCALE SEMICONDUCTOR INC
NXP SEMICONDUCTORS
Part Package Code
SOIC
Package Description
SOIC-32
HSSOP, SSOP32,.4
Pin Count
32
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.31.00.01
8542.39.00.01
Built-in Protections
TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE
TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE
Driver Number of Bits
8
8
Input Characteristics
STANDARD
STANDARD
Interface IC Type
BUFFER OR INVERTER BASED PERIPHERAL DRIVER
BUFFER OR INVERTER BASED PERIPHERAL DRIVER
JESD-30 Code
R-PDSO-G32
R-PDSO-G32
JESD-609 Code
e3
e3
Length
11 mm
11 mm
Moisture Sensitivity Level
3
3
Number of Functions
1
1
Number of Terminals
32
32
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-40 °C
-40 °C
Output Characteristics
OPEN-DRAIN
OPEN-DRAIN
Output Current Flow Direction
SINK
SINK
Output Peak Current Limit-Nom
1.2 A
1.2 A
Output Polarity
TRUE
TRUE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
HSSOP
HSSOP
Package Equivalence Code
SSOP32,.4
SSOP32,.4
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH
SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH
Peak Reflow Temperature (Cel)
245
260
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
2.65 mm
2.45 mm
Supply Current-Max
0.7 mA
0.7 mA
Supply Voltage-Max
5.5 V
5.5 V
Supply Voltage-Min
3.1 V
3.1 V
Supply Voltage-Nom
5 V
5 V
Surface Mount
YES
YES
Technology
MOS
MOS
Temperature Grade
AUTOMOTIVE
AUTOMOTIVE
Terminal Finish
MATTE TIN
Tin (Sn)
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.65 mm
0.65 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
30
40
Turn-off Time
100 µs
100 µs
Turn-on Time
50 µs
50 µs
Width
7.5 mm
7.5 mm
Base Number Matches
1
1
Samacsys Manufacturer
NXP
Compare MC33879EKR2 with alternatives
Compare MC33879TEKR2 with alternatives