MC33389CVW
vs
935290083029
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
FREESCALE SEMICONDUCTOR INC
NXP SEMICONDUCTORS
Part Package Code
SOIC
Package Description
HSOP,
DIE,
Pin Count
20
Reach Compliance Code
unknown
unknown
ECCN Code
EAR99
HTS Code
8542.31.00.01
8542.39.00.01
JESD-30 Code
R-PDSO-G20
R-XUUC-N13
Length
15.9 mm
Moisture Sensitivity Level
3
Number of Functions
1
1
Number of Terminals
20
13
Operating Temperature-Max
125 °C
Operating Temperature-Min
-40 °C
Package Body Material
PLASTIC/EPOXY
UNSPECIFIED
Package Code
HSOP
DIE
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE, HEAT SINK/SLUG
UNCASED CHIP
Peak Reflow Temperature (Cel)
245
Qualification Status
Not Qualified
Seated Height-Max
3.4 mm
Supply Voltage-Nom
12 V
12 V
Surface Mount
YES
YES
Telecom IC Type
INTERFACE CIRCUIT
INTERFACE CIRCUIT
Temperature Grade
AUTOMOTIVE
Terminal Form
GULL WING
NO LEAD
Terminal Pitch
1.27 mm
Terminal Position
DUAL
UPPER
Time@Peak Reflow Temperature-Max (s)
30
Width
11 mm
Base Number Matches
1
1
Screening Level
AEC-Q100
Compare MC33389CVW with alternatives
Compare 935290083029 with alternatives