MC33389CVW
vs
BD41020FJ-CE2
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
FREESCALE SEMICONDUCTOR INC
ROHM CO LTD
Part Package Code
SOIC
Package Description
HSOP,
LSOP,
Pin Count
20
Reach Compliance Code
unknown
compliant
ECCN Code
EAR99
HTS Code
8542.31.00.01
8542.39.00.01
JESD-30 Code
R-PDSO-G20
R-PDSO-G8
Length
15.9 mm
4.9 mm
Moisture Sensitivity Level
3
Number of Functions
1
1
Number of Terminals
20
8
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-40 °C
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
HSOP
LSOP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE, HEAT SINK/SLUG
SMALL OUTLINE, LOW PROFILE
Peak Reflow Temperature (Cel)
245
NOT SPECIFIED
Qualification Status
Not Qualified
Seated Height-Max
3.4 mm
1.65 mm
Supply Voltage-Nom
12 V
12 V
Surface Mount
YES
YES
Telecom IC Type
INTERFACE CIRCUIT
INTERFACE CIRCUIT
Temperature Grade
AUTOMOTIVE
AUTOMOTIVE
Terminal Form
GULL WING
GULL WING
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
30
NOT SPECIFIED
Width
11 mm
3.9 mm
Base Number Matches
1
1
Samacsys Manufacturer
ROHM Semiconductor
Compare MC33389CVW with alternatives
Compare BD41020FJ-CE2 with alternatives