MC33388DR2
vs
TJA1055T/3/C,512
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
FREESCALE SEMICONDUCTOR INC
|
NXP SEMICONDUCTORS
|
| Part Package Code |
SOIC
|
SOIC
|
| Package Description |
PLASTIC, SO-14
|
3.90 MM, PLASTIC, SOT-108-1, MS-012, SOP-14
|
| Pin Count |
14
|
14
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
|
| HTS Code |
8542.31.00.01
|
8542.39.00.01
|
| JESD-30 Code |
R-PDSO-G14
|
R-PDSO-G14
|
| Length |
8.65 mm
|
8.65 mm
|
| Moisture Sensitivity Level |
1
|
3
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
14
|
14
|
| Operating Temperature-Max |
125 °C
|
|
| Operating Temperature-Min |
-40 °C
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
SOP
|
SOP
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE
|
SMALL OUTLINE
|
| Peak Reflow Temperature (Cel) |
220
|
260
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.75 mm
|
1.75 mm
|
| Supply Voltage-Nom |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Telecom IC Type |
INTERFACE CIRCUIT
|
INTERFACE CIRCUIT
|
| Temperature Grade |
AUTOMOTIVE
|
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
1.27 mm
|
1.27 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
| Width |
3.9 mm
|
3.9 mm
|
| Base Number Matches |
1
|
1
|
| Manufacturer Package Code |
|
SOT108-1
|
| Samacsys Manufacturer |
|
NXP
|
| JESD-609 Code |
|
e4
|
| Terminal Finish |
|
NICKEL PALLADIUM GOLD
|
|
|
|
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TJA1055T/3/C,512 vs TJA1055T/3,518