MC33368PG
vs
MC33368DR2
feature comparison
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Obsolete
|
Transferred
|
| Ihs Manufacturer |
ONSEMI
|
MOTOROLA INC
|
| Part Package Code |
DIP
|
SOIC
|
| Package Description |
LEAD FREE, PLASTIC, DIP-16
|
SOP, SOP16,.25
|
| Pin Count |
16
|
16
|
| Reach Compliance Code |
unknown
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Factory Lead Time |
4 Weeks
|
|
| Analog IC - Other Type |
POWER FACTOR CONTROLLER
|
POWER FACTOR CONTROLLER
|
| Control Mode |
CURRENT-MODE
|
CURRENT-MODE
|
| Control Technique |
PULSE WIDTH MODULATION
|
PULSE WIDTH MODULATION
|
| Input Voltage-Max |
16 V
|
16 V
|
| Input Voltage-Min |
10 V
|
9 V
|
| Input Voltage-Nom |
14.5 V
|
14.5 V
|
| JESD-30 Code |
R-PDIP-T16
|
R-PDSO-G16
|
| JESD-609 Code |
e3
|
e0
|
| Length |
19.175 mm
|
9.9 mm
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
16
|
16
|
| Operating Temperature-Max |
125 °C
|
85 °C
|
| Operating Temperature-Min |
-25 °C
|
-25 °C
|
| Output Current-Max |
0.01 A
|
1.5 A
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
DIP
|
SOP
|
| Package Equivalence Code |
DIP16,.3
|
SOP16,.25
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
SMALL OUTLINE
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
4.44 mm
|
1.75 mm
|
| Surface Mount |
NO
|
YES
|
| Switcher Configuration |
BOOST
|
SINGLE
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
OTHER
|
OTHER
|
| Terminal Finish |
TIN
|
Tin/Lead (Sn/Pb)
|
| Terminal Form |
THROUGH-HOLE
|
GULL WING
|
| Terminal Pitch |
2.54 mm
|
1.27 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Width |
7.62 mm
|
3.9 mm
|
| Base Number Matches |
1
|
1
|
| Output Voltage-Nom |
|
5 V
|
| Supply Current-Max (Isup) |
|
8.5 mA
|
|
|
|
Compare MC33368PG with alternatives
Compare MC33368DR2 with alternatives