MC33368D
vs
MC33368PG
feature comparison
| Part Life Cycle Code |
Transferred
|
Active
|
| Ihs Manufacturer |
MOTOROLA INC
|
ROCHESTER ELECTRONICS LLC
|
| Part Package Code |
SOIC
|
DIP
|
| Package Description |
SOP, SOP16,.25
|
LEAD FREE, PLASTIC, DIP-16
|
| Pin Count |
16
|
16
|
| Reach Compliance Code |
unknown
|
unknown
|
| ECCN Code |
EAR99
|
|
| HTS Code |
8542.39.00.01
|
|
| Analog IC - Other Type |
POWER FACTOR CONTROLLER
|
POWER FACTOR CONTROLLER
|
| Control Mode |
CURRENT-MODE
|
CURRENT-MODE
|
| Control Technique |
PULSE WIDTH MODULATION
|
PULSE WIDTH MODULATION
|
| Input Voltage-Max |
16 V
|
16 V
|
| Input Voltage-Min |
9 V
|
10 V
|
| Input Voltage-Nom |
14.5 V
|
14.5 V
|
| JESD-30 Code |
R-PDSO-G16
|
R-PDIP-T16
|
| JESD-609 Code |
e0
|
e3
|
| Length |
9.9 mm
|
19.175 mm
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
16
|
16
|
| Operating Temperature-Max |
85 °C
|
125 °C
|
| Operating Temperature-Min |
-25 °C
|
-25 °C
|
| Output Current-Max |
1.5 A
|
0.01 A
|
| Output Voltage-Nom |
5 V
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
SOP
|
DIP
|
| Package Equivalence Code |
SOP16,.25
|
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE
|
IN-LINE
|
| Qualification Status |
Not Qualified
|
|
| Seated Height-Max |
1.75 mm
|
4.44 mm
|
| Supply Current-Max (Isup) |
8.5 mA
|
|
| Surface Mount |
YES
|
NO
|
| Switcher Configuration |
SINGLE
|
BOOST
|
| Technology |
CMOS
|
|
| Temperature Grade |
OTHER
|
OTHER
|
| Terminal Finish |
Tin/Lead (Sn/Pb)
|
MATTE TIN
|
| Terminal Form |
GULL WING
|
THROUGH-HOLE
|
| Terminal Pitch |
1.27 mm
|
2.54 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Width |
3.9 mm
|
7.62 mm
|
| Base Number Matches |
2
|
1
|
| Pbfree Code |
|
No
|
| Rohs Code |
|
Yes
|
| Moisture Sensitivity Level |
|
NOT SPECIFIED
|
| Peak Reflow Temperature (Cel) |
|
NOT SPECIFIED
|
| Time@Peak Reflow Temperature-Max (s) |
|
NOT SPECIFIED
|
|
|
|
Compare MC33368D with alternatives
Compare MC33368PG with alternatives