MC2010-7503-FBQ vs RS10K7503FB feature comparison

MC2010-7503-FBQ RCD Components Inc

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RS10K7503FB Fenghua (HK) Electronics Ltd

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Rohs Code No Yes
Part Life Cycle Code Active Active
Ihs Manufacturer RCD COMPONENTS INC FENGHUA ADVANCED TECHNOLOGY
Package Description CHIP CHIP
Reach Compliance Code compliant unknown
ECCN Code EAR99 EAR99
HTS Code 8533.21.00.30 8533.21.00.30
Construction Rectangular RECTANGULAR PACKAGE
JESD-609 Code e0
Mounting Feature SURFACE MOUNT SURFACE MOUNT
Number of Terminals 2 2
Operating Temperature-Max 155 °C 155 °C
Operating Temperature-Min -55 °C -55 °C
Package Height 0.6 mm 0.55 mm
Package Length 5 mm 5 mm
Package Style SMT SMT
Package Width 2.6 mm 2.5 mm
Packing Method Bulk Bulk
Rated Power Dissipation (P) 0.75 W 0.75 W
Rated Temperature 70 °C 70 °C
Resistance 750000 Ω 750000 Ω
Resistor Type FIXED RESISTOR FIXED RESISTOR
Size Code 2010 2010
Surface Mount YES YES
Technology METAL GLAZE/THICK FILM METAL GLAZE/THICK FILM
Temperature Coefficient 100 ppm/°C 100 ppm/°C
Terminal Finish Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier
Terminal Shape WRAPAROUND WRAPAROUND
Tolerance 1% 1%
Working Voltage 200 V 200 V
Base Number Matches 1 1
Package Shape RECTANGULAR PACKAGE

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