MC1558SU vs TL082CP feature comparison

MC1558SU Freescale Semiconductor

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TL082CP STMicroelectronics

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Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer MOTOROLA SEMICONDUCTOR PRODUCTS STMICROELECTRONICS
Package Description DIP, DIP8,.3 TSSOP-8
Reach Compliance Code unknown not_compliant
Amplifier Type OPERATIONAL AMPLIFIER OPERATIONAL AMPLIFIER
Architecture VOLTAGE-FEEDBACK VOLTAGE-FEEDBACK
Average Bias Current-Max (IIB) 0.5 µA 0.02 µA
Common-mode Reject Ratio-Nom 90 dB 70 dB
Frequency Compensation YES YES
Input Offset Voltage-Max 6000 µV 13000 µV
JESD-30 Code R-XDIP-T8 R-PDSO-G8
JESD-609 Code e0 e0
Length 10.415 mm 4.4 mm
Low-Offset NO NO
Neg Supply Voltage-Nom (Vsup) -15 V -15 V
Number of Functions 2 2
Number of Terminals 8 8
Operating Temperature-Max 125 °C 70 °C
Operating Temperature-Min -55 °C
Package Body Material CERAMIC PLASTIC/EPOXY
Package Code DIP TSSOP
Package Equivalence Code DIP8,.3 TSSOP8,.25
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Peak Reflow Temperature (Cel) NOT SPECIFIED
Power Supplies +-15 V
Qualification Status Not Qualified Not Qualified
Seated Height-Max 5.08 mm 1.2 mm
Slew Rate-Min 10 V/us 8 V/us
Slew Rate-Nom 20 V/us 16 V/us
Supply Voltage-Nom (Vsup) 15 V 15 V
Surface Mount NO YES
Technology BIPOLAR BIPOLAR
Temperature Grade MILITARY COMMERCIAL
Terminal Finish Tin/Lead (Sn/Pb) TIN LEAD
Terminal Form THROUGH-HOLE GULL WING
Terminal Pitch 2.54 mm 0.65 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Unity Gain BW-Nom 1000 4000
Width 7.62 mm 3 mm
Base Number Matches 1 2
Part Package Code SOIC
Pin Count 8
ECCN Code EAR99
HTS Code 8542.33.00.01
Bias Current-Max (IIB) @25C 0.0004 µA
Input Offset Current-Max (IIO) 0.01 µA
Low-Bias YES
Neg Supply Voltage Limit-Max -18 V
Packing Method TUBE
Supply Current-Max 2.5 mA
Supply Voltage Limit-Max 18 V
Voltage Gain-Min 15000

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