TL082CP vs MC4558CU feature comparison

TL082CP onsemi

Buy Now Datasheet

MC4558CU Freescale Semiconductor

Buy Now Datasheet
Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer ONSEMI MOTOROLA SEMICONDUCTOR PRODUCTS
Part Package Code DIP
Package Description PLASTIC, DIP-8 DIP, DIP8,.3
Pin Count 8
Reach Compliance Code not_compliant unknown
ECCN Code EAR99
HTS Code 8542.33.00.01
Amplifier Type OPERATIONAL AMPLIFIER OPERATIONAL AMPLIFIER
Architecture VOLTAGE-FEEDBACK VOLTAGE-FEEDBACK
Average Bias Current-Max (IIB) 0.01 µA 0.5 µA
Bias Current-Max (IIB) @25C 0.0004 µA 0.5 µA
Common-mode Reject Ratio-Nom 100 dB 90 dB
Frequency Compensation YES YES
Input Offset Voltage-Max 20000 µV 7500 µV
JESD-30 Code R-PDIP-T8 R-XDIP-T8
JESD-609 Code e0 e0
Length 9.78 mm 10.415 mm
Low-Bias YES
Low-Offset NO NO
Neg Supply Voltage Limit-Max -18 V -18 V
Neg Supply Voltage-Nom (Vsup) -15 V -15 V
Number of Functions 2 2
Number of Terminals 8 8
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Package Body Material PLASTIC/EPOXY CERAMIC
Package Code DIP DIP
Package Equivalence Code DIP8,.3 DIP8,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Peak Reflow Temperature (Cel) 235 NOT SPECIFIED
Qualification Status Not Qualified Not Qualified
Seated Height-Max 4.45 mm 5.08 mm
Slew Rate-Nom 13 V/us 1.6 V/us
Supply Voltage Limit-Max 18 V 18 V
Supply Voltage-Nom (Vsup) 15 V 15 V
Surface Mount NO NO
Technology BIPOLAR BIPOLAR
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish TIN LEAD Tin/Lead (Sn/Pb)
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Unity Gain BW-Nom 4000 2800
Width 7.62 mm 7.62 mm
Base Number Matches 8 3
Common-mode Reject Ratio-Min 70 dB
Power Supplies +-15 V
Slew Rate-Min 1 V/us
Supply Current-Max 6.7 mA
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Voltage Gain-Min 15000

Compare TL082CP with alternatives

Compare MC4558CU with alternatives