MC14LC5002FB
vs
MC14LC5002FB
feature comparison
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Obsolete
|
Active
|
| Ihs Manufacturer |
MOTOROLA INC
|
NXP SEMICONDUCTORS
|
| Part Package Code |
QFP
|
|
| Package Description |
LQFP, QFP32,.35SQ,32
|
TQFP-32
|
| Pin Count |
32
|
|
| Reach Compliance Code |
unknown
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Data Input Mode |
SERIAL
|
SERIAL
|
| Display Mode |
DOT MATRIX
|
DOT MATRIX
|
| Interface IC Type |
LIQUID CRYSTAL DISPLAY DRIVER
|
LIQUID CRYSTAL DISPLAY DRIVER
|
| JESD-30 Code |
S-PQFP-G32
|
S-PQFP-G32
|
| JESD-609 Code |
e0
|
|
| Length |
7 mm
|
7 mm
|
| Multiplexed Display Capability |
YES
|
YES
|
| Number of Functions |
1
|
1
|
| Number of Segments |
72
|
72
|
| Number of Terminals |
32
|
32
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
LQFP
|
LQFP
|
| Package Equivalence Code |
QFP32,.35SQ,32
|
QFP32,.35SQ,32
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
FLATPACK, LOW PROFILE
|
FLATPACK, LOW PROFILE
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.6 mm
|
1.6 mm
|
| Supply Current-Max |
0.4 mA
|
0.4 mA
|
| Supply Voltage-Max |
5.5 V
|
5.5 V
|
| Supply Voltage-Min |
2.7 V
|
2.7 V
|
| Supply Voltage-Nom |
5 V
|
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
TIN LEAD
|
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
0.8 mm
|
0.8 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Width |
7 mm
|
7 mm
|
| fmax-Min |
0.15 MHz
|
|
| Base Number Matches |
1
|
1
|
|
|
|