MC14C88BP
vs
DS1488J
feature comparison
Rohs Code |
No
|
No
|
Part Life Cycle Code |
Transferred
|
Obsolete
|
Ihs Manufacturer |
MOTOROLA INC
|
NATIONAL SEMICONDUCTOR CORP
|
Package Description |
DIP, DIP14,.3
|
DIP, DIP14,.3
|
Reach Compliance Code |
unknown
|
unknown
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Additional Feature |
1 SINGLE INPUT DRIVER
|
1 SINGLE INPUT DRIVER; PROGRAMMABLE SLEW RATE
|
Differential Output |
NO
|
NO
|
Driver Number of Bits |
4
|
4
|
High Level Input Current-Max |
0.00001 A
|
0.00001 A
|
Input Characteristics |
GATED
|
GATED
|
Interface IC Type |
LINE DRIVER
|
LINE DRIVER
|
Interface Standard |
EIA-232-D; V.28; EIA-562
|
EIA-232-D; V.24
|
JESD-30 Code |
R-PDIP-T14
|
R-GDIP-T14
|
JESD-609 Code |
e0
|
e0
|
Length |
18.86 mm
|
19.43 mm
|
Number of Functions |
1
|
4
|
Number of Terminals |
14
|
14
|
Operating Temperature-Max |
85 °C
|
75 °C
|
Operating Temperature-Min |
-40 °C
|
|
Out Swing-Min |
7.4 V
|
12 V
|
Output Characteristics |
TOTEM-POLE
|
TOTEM-POLE
|
Output Polarity |
INVERTED
|
INVERTED
|
Package Body Material |
PLASTIC/EPOXY
|
CERAMIC, GLASS-SEALED
|
Package Code |
DIP
|
DIP
|
Package Equivalence Code |
DIP14,.3
|
DIP14,.3
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
IN-LINE
|
IN-LINE
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Receive Delay-Max |
|
|
Seated Height-Max |
4.69 mm
|
5.08 mm
|
Supply Voltage-Max |
15 V
|
15 V
|
Supply Voltage-Min |
4.5 V
|
|
Supply Voltage-Nom |
12 V
|
9 V
|
Surface Mount |
NO
|
NO
|
Technology |
BIMOS
|
BIPOLAR
|
Temperature Grade |
INDUSTRIAL
|
COMMERCIAL EXTENDED
|
Terminal Finish |
TIN LEAD
|
Tin/Lead (Sn/Pb)
|
Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
Terminal Pitch |
2.54 mm
|
2.54 mm
|
Terminal Position |
DUAL
|
DUAL
|
Transmit Delay-Max |
3500 ns
|
175 ns
|
Width |
7.62 mm
|
7.62 mm
|
Base Number Matches |
5
|
2
|
Supply Current-Max |
|
34 mA
|
Supply Voltage1-Max |
|
-15 V
|
Supply Voltage1-Nom |
|
-9 V
|
|
|
|
Compare DS1488J with alternatives