MC14598BCL
vs
MC14598BALD
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
MOTOROLA INC
MOTOROLA INC
Package Description
CERAMIC, DIP-18
DIP, DIP18,.3
Reach Compliance Code
unknown
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Additional Feature
1:8 DMUX FOLLOWED BY LATCH
1:8 DMUX FOLLOWED BY LATCH
Family
4000/14000/40000
4000/14000/40000
JESD-30 Code
R-GDIP-T18
R-GDIP-T18
JESD-609 Code
e0
e0
Length
22.73 mm
22.73 mm
Load Capacitance (CL)
130 pF
Logic IC Type
D LATCH
D LATCH
Max I(ol)
0.0012 A
Number of Bits
1
1
Number of Functions
1
1
Number of Terminals
18
18
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Output Characteristics
3-STATE
3-STATE
Output Polarity
TRUE
TRUE
Package Body Material
CERAMIC, GLASS-SEALED
CERAMIC, GLASS-SEALED
Package Code
DIP
DIP
Package Equivalence Code
DIP18,.3
DIP18,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Prop. Delay@Nom-Sup
160 ns
Propagation Delay (tpd)
400 ns
320 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
5.08 mm
5.08 mm
Supply Voltage-Max (Vsup)
18 V
18 V
Supply Voltage-Min (Vsup)
3 V
3 V
Supply Voltage-Nom (Vsup)
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
MILITARY
MILITARY
Terminal Finish
TIN LEAD
TIN LEAD
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Trigger Type
HIGH LEVEL
HIGH LEVEL
Width
7.62 mm
7.62 mm
Base Number Matches
4
2
Compare MC14598BCL with alternatives
Compare MC14598BALD with alternatives