MC1455P1 vs MC1455P1G feature comparison

MC1455P1 Motorola Mobility LLC

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MC1455P1G onsemi

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Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer MOTOROLA INC ONSEMI
Part Package Code DIP 8 LEAD PDIP
Package Description DIP, DIP8,.3 DIP-8
Pin Count 8 8
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8542.39.00.01 8542.39.00.01
Analog IC - Other Type PULSE PULSE; RECTANGULAR
JESD-30 Code R-PDIP-T8 R-PDIP-T8
JESD-609 Code e0 e3
Length 9.78 mm 9.78 mm
Number of Functions 1 1
Number of Terminals 8 8
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP DIP
Package Equivalence Code DIP8,.3 DIP8,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Qualification Status Not Qualified Not Qualified
Seated Height-Max 4.45 mm 4.45 mm
Supply Current-Max (Isup) 15 mA
Supply Voltage-Max (Vsup) 16 V 16 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology BIPOLAR BIPOLAR
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish Tin/Lead (Sn/Pb) Tin (Sn)
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Width 7.62 mm 7.62 mm
Base Number Matches 6 1
Pbfree Code Yes
Manufacturer Package Code 626-05
Samacsys Manufacturer onsemi
Peak Reflow Temperature (Cel) 260
Time@Peak Reflow Temperature-Max (s) 40

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Compare MC1455P1G with alternatives