MC1455P1
vs
ICM7555MJA/HR
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
MOTOROLA SEMICONDUCTOR PRODUCTS
MAXIM INTEGRATED PRODUCTS INC
Package Description
DIP, DIP8,.3
DIP, DIP8,.3
Reach Compliance Code
unknown
not_compliant
JESD-30 Code
R-PDIP-T8
R-GDIP-T8
JESD-609 Code
e0
e0
Number of Terminals
8
8
Operating Temperature-Max
70 °C
125 °C
Operating Temperature-Min
-55 °C
Package Body Material
PLASTIC/EPOXY
CERAMIC, GLASS-SEALED
Package Code
DIP
DIP
Package Equivalence Code
DIP8,.3
DIP8,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Power Supplies
5/15 V
Qualification Status
Not Qualified
Not Qualified
Surface Mount
NO
NO
Technology
BIPOLAR
CMOS
Temperature Grade
COMMERCIAL
MILITARY
Terminal Finish
Tin/Lead (Sn/Pb)
TIN LEAD
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Base Number Matches
6
2
Pbfree Code
Part Package Code
DIP
Pin Count
8
ECCN Code
EAR99
HTS Code
8542.39.00.01
Analog IC - Other Type
TIMER
Moisture Sensitivity Level
1
Number of Functions
1
Output Frequency-Max
0.5 MHz
Screening Level
MIL-STD-883 Class B (Modified)
Seated Height-Max
5.08 mm
Supply Voltage-Max (Vsup)
16 V
Supply Voltage-Min (Vsup)
3 V
Supply Voltage-Nom (Vsup)
5 V
Width
7.62 mm
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