MC1455P1
vs
ICM7555IPAZ
feature comparison
| Part Life Cycle Code |
Transferred
|
Transferred
|
| Ihs Manufacturer |
MOTOROLA INC
|
INTERSIL CORP
|
| Part Package Code |
DIP
|
PDIP, SOIC
|
| Package Description |
DIP, DIP8,.3
|
DIP, DIP8,.3
|
| Pin Count |
8
|
8, 8
|
| Reach Compliance Code |
unknown
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.39.00.01
|
8542.33.00.01
|
| Analog IC - Other Type |
PULSE
|
SQUARE
|
| JESD-30 Code |
R-PDIP-T8
|
R-PDIP-T8
|
| JESD-609 Code |
e0
|
e3
|
| Length |
9.78 mm
|
9.585 mm
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
8
|
8
|
| Operating Temperature-Max |
70 °C
|
85 °C
|
| Operating Temperature-Min |
|
-25 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
DIP
|
DIP
|
| Package Equivalence Code |
DIP8,.3
|
DIP8,.3
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
IN-LINE
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
4.45 mm
|
5.33 mm
|
| Supply Current-Max (Isup) |
15 mA
|
|
| Supply Voltage-Max (Vsup) |
16 V
|
18 V
|
| Supply Voltage-Min (Vsup) |
4.5 V
|
2 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
NO
|
NO
|
| Technology |
BIPOLAR
|
CMOS
|
| Temperature Grade |
COMMERCIAL
|
COMMERCIAL EXTENDED
|
| Terminal Finish |
Tin/Lead (Sn/Pb)
|
MATTE TIN
|
| Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
| Terminal Pitch |
2.54 mm
|
2.54 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Width |
7.62 mm
|
7.62 mm
|
| Base Number Matches |
6
|
2
|
| Factory Lead Time |
|
78 Weeks
|
| Output Frequency-Max |
|
1 MHz
|
|
|
|
Compare MC1455P1 with alternatives
Compare ICM7555IPAZ with alternatives