MC1455P1
vs
ICM7555IPAZ
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
MOTOROLA INC
INTERSIL CORP
Part Package Code
DIP
PDIP, SOIC
Package Description
DIP, DIP8,.3
DIP, DIP8,.3
Pin Count
8
8, 8
Reach Compliance Code
unknown
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.39.00.01
8542.33.00.01
Analog IC - Other Type
PULSE
SQUARE
JESD-30 Code
R-PDIP-T8
R-PDIP-T8
JESD-609 Code
e0
e3
Length
9.78 mm
9.585 mm
Number of Functions
1
1
Number of Terminals
8
8
Operating Temperature-Max
70 °C
85 °C
Operating Temperature-Min
-25 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
DIP
DIP
Package Equivalence Code
DIP8,.3
DIP8,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
4.45 mm
5.33 mm
Supply Current-Max (Isup)
15 mA
Supply Voltage-Max (Vsup)
16 V
18 V
Supply Voltage-Min (Vsup)
4.5 V
2 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
BIPOLAR
CMOS
Temperature Grade
COMMERCIAL
COMMERCIAL EXTENDED
Terminal Finish
Tin/Lead (Sn/Pb)
MATTE TIN
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Width
7.62 mm
7.62 mm
Base Number Matches
6
2
Factory Lead Time
78 Weeks
Output Frequency-Max
1 MHz
Compare MC1455P1 with alternatives
Compare ICM7555IPAZ with alternatives