MC14555BCPG
vs
HEF4555BP
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
ONSEMI
NXP SEMICONDUCTORS
Part Package Code
DIP
DIP
Package Description
ROHS COMPLIANT, PLASTIC, DIP-16
PLASTIC, SOT-38-1, DIP-16
Pin Count
16
16
Reach Compliance Code
unknown
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.39.00.01
8542.39.00.01
Factory Lead Time
4 Weeks
Samacsys Manufacturer
onsemi
Family
4000/14000/40000
4000/14000/40000
Input Conditioning
STANDARD
STANDARD
JESD-30 Code
R-PDIP-T16
R-PDIP-T16
JESD-609 Code
e3
e4
Length
19.175 mm
21.6 mm
Load Capacitance (CL)
50 pF
50 pF
Logic IC Type
2-LINE TO 4-LINE DECODER
2-LINE TO 4-LINE DECODER
Number of Functions
2
2
Number of Terminals
16
16
Operating Temperature-Max
125 °C
85 °C
Operating Temperature-Min
-55 °C
-40 °C
Output Polarity
TRUE
TRUE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
DIP
DIP
Package Equivalence Code
DIP16,.3
DIP16,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Packing Method
RAIL
Peak Reflow Temperature (Cel)
260
Prop. Delay@Nom-Sup
440 ns
295 ns
Propagation Delay (tpd)
440 ns
280 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
4.44 mm
4.7 mm
Supply Voltage-Max (Vsup)
18 V
15 V
Supply Voltage-Min (Vsup)
3 V
3 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
MILITARY
INDUSTRIAL
Terminal Finish
Tin (Sn)
NICKEL PALLADIUM GOLD
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Width
7.62 mm
7.62 mm
Base Number Matches
1
2
Max I(ol)
0.00035999999999999997 A
Compare MC14555BCPG with alternatives
Compare HEF4555BP with alternatives