MC14518BDWR2G
vs
MC14518BCLD
feature comparison
Pbfree Code |
Yes
|
|
Part Life Cycle Code |
Active
|
Obsolete
|
Ihs Manufacturer |
ONSEMI
|
MOTOROLA SEMICONDUCTOR PRODUCTS
|
Part Package Code |
SO-16 WB
|
|
Package Description |
SOIC-16
|
DIP, DIP16,.3
|
Pin Count |
16
|
|
Manufacturer Package Code |
751G-03
|
|
Reach Compliance Code |
compliant
|
unknown
|
HTS Code |
8542.39.00.01
|
|
Factory Lead Time |
4 Weeks
|
|
Samacsys Manufacturer |
onsemi
|
|
Count Direction |
UP
|
UP
|
Family |
4000/14000/40000
|
|
JESD-30 Code |
R-PDSO-G16
|
R-XDIP-T16
|
JESD-609 Code |
e3
|
e0
|
Length |
10.3 mm
|
|
Logic IC Type |
DECADE COUNTER
|
DECADE COUNTER
|
Mode of Operation |
SYNCHRONOUS
|
SYNCHRONOUS
|
Moisture Sensitivity Level |
3
|
|
Number of Bits |
4
|
|
Number of Functions |
2
|
2
|
Number of Terminals |
16
|
16
|
Operating Temperature-Max |
125 °C
|
85 °C
|
Operating Temperature-Min |
-55 °C
|
-40 °C
|
Package Body Material |
PLASTIC/EPOXY
|
CERAMIC
|
Package Code |
SOP
|
DIP
|
Package Equivalence Code |
SOP16,.4
|
DIP16,.3
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
SMALL OUTLINE
|
IN-LINE
|
Packing Method |
TR
|
|
Peak Reflow Temperature (Cel) |
260
|
|
Propagation Delay (tpd) |
560 ns
|
|
Qualification Status |
Not Qualified
|
|
Seated Height-Max |
2.65 mm
|
|
Supply Voltage-Max (Vsup) |
18 V
|
|
Supply Voltage-Min (Vsup) |
3 V
|
|
Supply Voltage-Nom (Vsup) |
5 V
|
|
Surface Mount |
YES
|
NO
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
MILITARY
|
INDUSTRIAL
|
Terminal Finish |
MATTE TIN
|
Tin/Lead (Sn/Pb)
|
Terminal Form |
GULL WING
|
THROUGH-HOLE
|
Terminal Pitch |
1.27 mm
|
2.54 mm
|
Terminal Position |
DUAL
|
DUAL
|
Time@Peak Reflow Temperature-Max (s) |
30
|
|
Trigger Type |
POSITIVE EDGE
|
|
Width |
7.5 mm
|
|
fmax-Min |
4 MHz
|
|
Base Number Matches |
1
|
3
|
Rohs Code |
|
No
|
Load/Preset Input |
|
YES
|
Power Supplies |
|
5/15 V
|
|
|
|
Compare MC14518BDWR2G with alternatives