MC14514BDW vs TC74HC138AF-TP1 feature comparison

MC14514BDW Motorola Mobility LLC

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TC74HC138AF-TP1 Toshiba America Electronic Components

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Part Life Cycle Code Transferred Active
Ihs Manufacturer MOTOROLA INC TOSHIBA CORP
Part Package Code SOIC SOIC
Package Description SOP, SOP,
Pin Count 24 16
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8542.39.00.01 8542.39.00.01
Additional Feature ADDRESS LATCHES 3 ENABLE INPUTS
Family 4000/14000/40000 HC/UH
JESD-30 Code R-PDSO-G24 R-PDSO-G16
JESD-609 Code e0 e0
Length 15.395 mm 10.3 mm
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type OTHER DECODER/DRIVER 3-LINE TO 8-LINE DECODER
Number of Functions 1 1
Number of Terminals 24 16
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -55 °C -40 °C
Output Polarity TRUE INVERTED
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP SOP
Package Equivalence Code SOP24,.4
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Propagation Delay (tpd) 800 ns 190 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.65 mm 1.9 mm
Supply Voltage-Max (Vsup) 18 V 6 V
Supply Voltage-Min (Vsup) 3 V 2 V
Supply Voltage-Nom (Vsup) 5 V 4.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade MILITARY INDUSTRIAL
Terminal Finish Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal Form GULL WING GULL WING
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position DUAL DUAL
Width 7.5 mm 5.3 mm
Base Number Matches 5 1
Pbfree Code No
Rohs Code No
Input Conditioning STANDARD
Peak Reflow Temperature (Cel) NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED

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