MC14514BDW
vs
935182580112
feature comparison
All Stats
Differences Only
Rohs Code
No
Yes
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
MOTOROLA SEMICONDUCTOR PRODUCTS
NXP SEMICONDUCTORS
Package Description
SOP, SOP24,.4
TSSOP,
Reach Compliance Code
unknown
unknown
JESD-30 Code
R-PDSO-G24
R-PDSO-G24
JESD-609 Code
e0
e4
Load Capacitance (CL)
50 pF
Logic IC Type
OTHER DECODER/DRIVER
4-LINE TO 16-LINE DECODER
Max I(ol)
0.00064 A
Number of Functions
1
1
Number of Terminals
24
24
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
SOP
TSSOP
Package Equivalence Code
SOP24,.4
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Power Supplies
5/15 V
Prop. Delay@Nom-Sup
1100 ns
Qualification Status
Not Qualified
Not Qualified
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
MILITARY
AUTOMOTIVE
Terminal Finish
Tin/Lead (Sn/Pb)
Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form
GULL WING
GULL WING
Terminal Pitch
1.27 mm
0.65 mm
Terminal Position
DUAL
DUAL
Base Number Matches
5
2
Pbfree Code
Yes
Part Package Code
TSSOP
Pin Count
24
ECCN Code
EAR99
HTS Code
8542.39.00.01
Additional Feature
2 ENABLE INPUTS
Family
HC/UH
Input Conditioning
STANDARD
Length
7.8 mm
Moisture Sensitivity Level
1
Output Polarity
INVERTED
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Propagation Delay (tpd)
225 ns
Seated Height-Max
1.1 mm
Supply Voltage-Max (Vsup)
6 V
Supply Voltage-Min (Vsup)
2 V
Supply Voltage-Nom (Vsup)
5 V
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Width
4.4 mm
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