MC14512BCPD
vs
HEF4512BPN
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
MOTOROLA SEMICONDUCTOR PRODUCTS
NXP SEMICONDUCTORS
Package Description
DIP, DIP16,.3
DIP,
Reach Compliance Code
unknown
unknown
Family
4000/14000/40000
4000/14000/40000
JESD-30 Code
R-PDIP-T16
R-PDIP-T16
JESD-609 Code
e0
Length
19.175 mm
21.6 mm
Load Capacitance (CL)
50 pF
50 pF
Logic IC Type
MULTIPLEXER
MULTIPLEXER
Number of Functions
1
1
Number of Inputs
8
8
Number of Outputs
1
1
Number of Terminals
16
16
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Output Characteristics
3-STATE
3-STATE
Output Polarity
TRUE
TRUE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
DIP
DIP
Package Equivalence Code
DIP16,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Power Supplies
5/15 V
Propagation Delay (tpd)
650 ns
200 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
4.44 mm
4.7 mm
Supply Voltage-Max (Vsup)
18 V
Supply Voltage-Min (Vsup)
3 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
Tin/Lead (Sn/Pb)
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Width
7.62 mm
7.62 mm
Base Number Matches
3
2
Part Package Code
DIP
Pin Count
16
HTS Code
8542.39.00.01
Compare MC14512BCPD with alternatives
Compare HEF4512BPN with alternatives