MC14504BFG
vs
MC14504BDR2
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
No
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
ONSEMI
|
MOTOROLA SEMICONDUCTOR PRODUCTS
|
| Part Package Code |
SOIC
|
|
| Package Description |
EIAJ, PLASTIC, SOIC-16
|
SOP, SOP16,.25
|
| Pin Count |
16
|
|
| Reach Compliance Code |
unknown
|
unknown
|
| ECCN Code |
EAR99
|
|
| HTS Code |
8542.39.00.01
|
|
| Factory Lead Time |
4 Weeks
|
|
| Samacsys Manufacturer |
onsemi
|
|
| Delay-Max |
550 ns
|
|
| Interface IC Type |
TTL/CMOS TO CMOS TRANSLATOR
|
TTL/CMOS TO CMOS TRANSLATOR
|
| JESD-30 Code |
R-PDSO-G16
|
R-PDSO-G16
|
| JESD-609 Code |
e4
|
e0
|
| Length |
10.2 mm
|
|
| Moisture Sensitivity Level |
3
|
|
| Number of Bits |
1
|
|
| Number of Functions |
6
|
|
| Number of Terminals |
16
|
16
|
| Operating Temperature-Max |
125 °C
|
85 °C
|
| Operating Temperature-Min |
-55 °C
|
-40 °C
|
| Output Latch or Register |
NONE
|
|
| Output Polarity |
TRUE
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
SOP
|
SOP
|
| Package Equivalence Code |
SOP16,.3
|
SOP16,.25
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE
|
SMALL OUTLINE
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
2.05 mm
|
|
| Supply Voltage-Max |
18 V
|
|
| Supply Voltage-Min |
3 V
|
|
| Supply Voltage-Nom |
5 V
|
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
MILITARY
|
INDUSTRIAL
|
| Terminal Finish |
NICKEL PALLADIUM GOLD
|
Tin/Lead (Sn/Pb)
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
1.27 mm
|
1.27 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
|
| Width |
5.275 mm
|
|
| Base Number Matches |
1
|
4
|
| Power Supplies |
|
5/15 V
|
|
|
|
Compare MC14504BFG with alternatives