MC14504BCL
vs
CD4504BDMSR
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
MOTOROLA SEMICONDUCTOR PRODUCTS
INTERSIL CORP
Package Description
DIP, DIP16,.3
DIP, DIP16,.3
Reach Compliance Code
unknown
not_compliant
Interface IC Type
TTL/CMOS TO CMOS TRANSLATOR
TTL/CMOS TO CMOS TRANSLATOR
JESD-30 Code
R-XDIP-T16
R-CDIP-T16
JESD-609 Code
e0
e0
Number of Terminals
16
16
Operating Temperature-Max
85 °C
125 °C
Operating Temperature-Min
-40 °C
-55 °C
Package Body Material
CERAMIC
CERAMIC, METAL-SEALED COFIRED
Package Code
DIP
DIP
Package Equivalence Code
DIP16,.3
DIP16,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Power Supplies
5/15 V
Qualification Status
Not Qualified
Not Qualified
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
MILITARY
Terminal Finish
Tin/Lead (Sn/Pb)
TIN LEAD
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Base Number Matches
3
2
Part Package Code
DIP
Pin Count
16
Delay-Max
743 ns
Number of Bits
1
Number of Functions
6
Output Latch or Register
NONE
Output Polarity
TRUE
Screening Level
MIL-PRF-38535 Class V
Seated Height-Max
5.08 mm
Total Dose
100k Rad(Si) V
Width
7.62 mm
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