MC1416P
vs
MC1413D
feature comparison
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
MOTOROLA SEMICONDUCTOR PRODUCTS
|
MOTOROLA SEMICONDUCTOR PRODUCTS
|
| Package Description |
DIP, DIP16,.3
|
SOP, SOP16,.25
|
| Reach Compliance Code |
unknown
|
unknown
|
| Driver Number of Bits |
7
|
7
|
| JESD-30 Code |
R-PDIP-T16
|
R-PDSO-G16
|
| JESD-609 Code |
e0
|
e0
|
| Number of Terminals |
16
|
16
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-20 °C
|
-20 °C
|
| Output Current-Max |
0.35 A
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
DIP
|
SOP
|
| Package Equivalence Code |
DIP16,.3
|
SOP16,.25
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
SMALL OUTLINE
|
| Power Supplies |
50 V
|
50 V
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Supply Voltage-Nom |
50 V
|
50 V
|
| Surface Mount |
NO
|
YES
|
| Technology |
BIPOLAR
|
BIPOLAR
|
| Temperature Grade |
OTHER
|
OTHER
|
| Terminal Finish |
Tin/Lead (Sn/Pb)
|
Tin/Lead (Sn/Pb)
|
| Terminal Form |
THROUGH-HOLE
|
GULL WING
|
| Terminal Pitch |
2.54 mm
|
1.27 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Base Number Matches |
4
|
5
|
|
|
|