MC1413DG
vs
MC1413BP
feature comparison
| Pbfree Code |
Yes
|
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
ONSEMI
|
MOTOROLA SEMICONDUCTOR PRODUCTS
|
| Part Package Code |
SOIC 16 LEAD
|
|
| Package Description |
SOIC-16
|
DIP, DIP16,.3
|
| Pin Count |
16
|
|
| Manufacturer Package Code |
751B-05
|
|
| Reach Compliance Code |
compliant
|
unknown
|
| ECCN Code |
EAR99
|
|
| HTS Code |
8542.39.00.01
|
|
| Factory Lead Time |
2 Days
|
|
| Samacsys Manufacturer |
onsemi
|
|
| Additional Feature |
LOGIC LEVEL COMPATIBLE
|
|
| Collector Current-Max (IC) |
0.5 A
|
|
| Collector-Emitter Voltage-Max |
50 V
|
|
| Configuration |
COMPLEX
|
|
| DC Current Gain-Min (hFE) |
1000
|
|
| JESD-30 Code |
R-PDSO-G16
|
R-PDIP-T16
|
| JESD-609 Code |
e3
|
e0
|
| Moisture Sensitivity Level |
1
|
|
| Number of Elements |
7
|
|
| Number of Terminals |
16
|
16
|
| Operating Temperature-Max |
150 °C
|
85 °C
|
| Operating Temperature-Min |
-20 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE
|
IN-LINE
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Polarity/Channel Type |
NPN
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Surface Mount |
YES
|
NO
|
| Terminal Finish |
MATTE TIN
|
Tin/Lead (Sn/Pb)
|
| Terminal Form |
GULL WING
|
THROUGH-HOLE
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
|
| Transistor Application |
SWITCHING
|
|
| Transistor Element Material |
SILICON
|
|
| Base Number Matches |
1
|
5
|
| Rohs Code |
|
No
|
| Driver Number of Bits |
|
7
|
| Package Code |
|
DIP
|
| Package Equivalence Code |
|
DIP16,.3
|
| Power Supplies |
|
50 V
|
| Supply Voltage-Nom |
|
50 V
|
| Technology |
|
BIPOLAR
|
| Temperature Grade |
|
INDUSTRIAL
|
| Terminal Pitch |
|
2.54 mm
|
|
|
|
Compare MC1413DG with alternatives