MC14099BCLD
vs
MC14099BDWR2G
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Active
Ihs Manufacturer
MOTOROLA INC
ONSEMI
Part Package Code
DIP
SO-16 WB
Package Description
DIP, DIP16,.3
SOIC-16
Pin Count
16
16
Reach Compliance Code
unknown
compliant
HTS Code
8542.39.00.01
8542.39.00.01
Additional Feature
1:8 DMUX FOLLOWED BY LATCH
1:8 DMUX FOLLOWED BY LATCH
Family
4000/14000/40000
4000/14000/40000
JESD-30 Code
R-GDIP-T16
R-PDSO-G16
JESD-609 Code
e0
e3
Length
19.3 mm
10.3 mm
Load Capacitance (CL)
50 pF
50 pF
Logic IC Type
D LATCH
D LATCH
Number of Bits
1
1
Number of Functions
1
1
Number of Terminals
16
16
Operating Temperature-Max
85 °C
125 °C
Operating Temperature-Min
-40 °C
-55 °C
Output Polarity
TRUE
TRUE
Package Body Material
CERAMIC, GLASS-SEALED
PLASTIC/EPOXY
Package Code
DIP
SOP
Package Equivalence Code
DIP16,.3
SOP16,.4
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
SMALL OUTLINE
Propagation Delay (tpd)
400 ns
400 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
4.19 mm
2.65 mm
Supply Voltage-Max (Vsup)
18 V
18 V
Supply Voltage-Min (Vsup)
3 V
3 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
MILITARY
Terminal Finish
TIN LEAD
MATTE TIN
Terminal Form
THROUGH-HOLE
GULL WING
Terminal Pitch
2.54 mm
1.27 mm
Terminal Position
DUAL
DUAL
Trigger Type
LOW LEVEL
LOW LEVEL
Width
7.62 mm
7.5 mm
Base Number Matches
2
1
Pbfree Code
Manufacturer Package Code
751G-03
Factory Lead Time
2 Days
Samacsys Manufacturer
onsemi
Moisture Sensitivity Level
3
Packing Method
TR
Peak Reflow Temperature (Cel)
260
Prop. Delay@Nom-Sup
400 ns
Time@Peak Reflow Temperature-Max (s)
30
Compare MC14099BCLD with alternatives
Compare MC14099BDWR2G with alternatives