MC14076BDG
vs
MC14076BCPDS
feature comparison
All Stats
Differences Only
Pbfree Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
ONSEMI
MOTOROLA INC
Part Package Code
SOIC 16 LEAD
DIP
Package Description
SOIC-16
DIP, DIP16,.3
Pin Count
16
16
Manufacturer Package Code
751B-05
Reach Compliance Code
compliant
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Factory Lead Time
4 Weeks
Samacsys Manufacturer
onsemi
Family
4000/14000/40000
4000/14000/40000
JESD-30 Code
R-PDSO-G16
R-PDIP-T16
JESD-609 Code
e3
e0
Length
9.9 mm
20.07 mm
Load Capacitance (CL)
50 pF
50 pF
Logic IC Type
D FLIP-FLOP
D FLIP-FLOP
Max Frequency@Nom-Sup
1800000 Hz
Moisture Sensitivity Level
1
Number of Bits
4
4
Number of Functions
1
1
Number of Terminals
16
16
Operating Temperature-Max
125 °C
85 °C
Operating Temperature-Min
-55 °C
-40 °C
Output Characteristics
3-STATE
3-STATE
Output Polarity
TRUE
TRUE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
SOP
DIP
Package Equivalence Code
SOP16,.25
DIP16,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE
IN-LINE
Packing Method
RAIL
Peak Reflow Temperature (Cel)
260
Propagation Delay (tpd)
600 ns
600 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.75 mm
4.69 mm
Supply Voltage-Max (Vsup)
18 V
18 V
Supply Voltage-Min (Vsup)
3 V
3 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
NO
Technology
CMOS
CMOS
Temperature Grade
MILITARY
INDUSTRIAL
Terminal Finish
MATTE TIN
TIN LEAD
Terminal Form
GULL WING
THROUGH-HOLE
Terminal Pitch
1.27 mm
2.54 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
30
Trigger Type
POSITIVE EDGE
POSITIVE EDGE
Width
3.9 mm
7.62 mm
fmax-Min
6 MHz
1.8 MHz
Base Number Matches
1
3
Rohs Code
Additional Feature
WITH HOLD MODE
Compare MC14076BDG with alternatives
Compare MC14076BCPDS with alternatives