MC14076BCPDS vs MC14076BCLDS feature comparison

MC14076BCPDS Motorola Mobility LLC

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MC14076BCLDS Freescale Semiconductor

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Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer MOTOROLA INC MOTOROLA SEMICONDUCTOR PRODUCTS
Part Package Code DIP
Package Description DIP, DIP16,.3 DIP, DIP16,.3
Pin Count 16
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01
Additional Feature WITH HOLD MODE
Family 4000/14000/40000
JESD-30 Code R-PDIP-T16 R-XDIP-T16
JESD-609 Code e0 e0
Length 20.07 mm
Load Capacitance (CL) 50 pF
Logic IC Type D FLIP-FLOP D FLIP-FLOP
Number of Bits 4
Number of Functions 1 4
Number of Terminals 16 16
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Output Characteristics 3-STATE 3-STATE
Output Polarity TRUE
Package Body Material PLASTIC/EPOXY CERAMIC
Package Code DIP DIP
Package Equivalence Code DIP16,.3 DIP16,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Propagation Delay (tpd) 600 ns
Qualification Status Not Qualified
Seated Height-Max 4.69 mm
Supply Voltage-Max (Vsup) 18 V
Supply Voltage-Min (Vsup) 3 V
Supply Voltage-Nom (Vsup) 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish TIN LEAD Tin/Lead (Sn/Pb)
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Trigger Type POSITIVE EDGE POSITIVE EDGE
Width 7.62 mm
fmax-Min 1.8 MHz
Base Number Matches 3 3
Power Supplies 5/15 V

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