MC14076BCPD
vs
MC14076BDG
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
MOTOROLA INC
ONSEMI
Package Description
DIP, DIP16,.3
SOIC-16
Reach Compliance Code
unknown
compliant
HTS Code
8542.39.00.01
8542.39.00.01
Additional Feature
WITH HOLD MODE; WITH DUAL OUTPUT ENABLE
Family
4000/14000/40000
4000/14000/40000
JESD-30 Code
R-PDIP-T16
R-PDSO-G16
JESD-609 Code
e0
e3
Length
19.175 mm
9.9 mm
Load Capacitance (CL)
50 pF
50 pF
Logic IC Type
D FLIP-FLOP
D FLIP-FLOP
Number of Bits
4
4
Number of Functions
1
1
Number of Terminals
16
16
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Output Characteristics
3-STATE
3-STATE
Output Polarity
TRUE
TRUE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
DIP
SOP
Package Equivalence Code
DIP16,.3
SOP16,.25
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
SMALL OUTLINE
Propagation Delay (tpd)
600 ns
600 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
4.44 mm
1.75 mm
Supply Voltage-Max (Vsup)
18 V
18 V
Supply Voltage-Min (Vsup)
3 V
3 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
YES
Technology
CMOS
CMOS
Temperature Grade
MILITARY
MILITARY
Terminal Finish
TIN LEAD
MATTE TIN
Terminal Form
THROUGH-HOLE
GULL WING
Terminal Pitch
2.54 mm
1.27 mm
Terminal Position
DUAL
DUAL
Trigger Type
POSITIVE EDGE
POSITIVE EDGE
Width
7.62 mm
3.9 mm
fmax-Min
1.8 MHz
6 MHz
Base Number Matches
3
1
Pbfree Code
Part Package Code
SOIC 16 LEAD
Pin Count
16
Manufacturer Package Code
751B-05
Factory Lead Time
4 Weeks
Samacsys Manufacturer
onsemi
Max Frequency@Nom-Sup
1800000 Hz
Moisture Sensitivity Level
1
Packing Method
RAIL
Peak Reflow Temperature (Cel)
260
Time@Peak Reflow Temperature-Max (s)
30
Compare MC14076BCPD with alternatives
Compare MC14076BDG with alternatives