MC14027BDR2
vs
MC14027BCP
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
MOTOROLA INC
MOTOROLA INC
Part Package Code
SOIC
DIP
Package Description
SOP, SOP16,.25
DIP, DIP16,.3
Pin Count
16
16
Reach Compliance Code
unknown
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Family
4000/14000/40000
4000/14000/40000
JESD-30 Code
R-PDSO-G16
R-PDIP-T16
JESD-609 Code
e0
e0
Length
9.9 mm
19.175 mm
Load Capacitance (CL)
50 pF
50 pF
Logic IC Type
J-K FLIP-FLOP
J-K FLIP-FLOP
Max Frequency@Nom-Sup
6500000 Hz
6500000 Hz
Max I(ol)
0.00088 A
0.00088 A
Number of Bits
2
2
Number of Functions
2
2
Number of Terminals
16
16
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Output Polarity
COMPLEMENTARY
COMPLEMENTARY
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
SOP
DIP
Package Equivalence Code
SOP16,.25
DIP16,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE
IN-LINE
Packing Method
TR
Propagation Delay (tpd)
350 ns
350 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.75 mm
4.44 mm
Supply Voltage-Max (Vsup)
18 V
18 V
Supply Voltage-Min (Vsup)
3 V
3 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
NO
Technology
CMOS
CMOS
Temperature Grade
MILITARY
MILITARY
Terminal Finish
Tin/Lead (Sn/Pb)
TIN LEAD
Terminal Form
GULL WING
THROUGH-HOLE
Terminal Pitch
1.27 mm
2.54 mm
Terminal Position
DUAL
DUAL
Trigger Type
POSITIVE EDGE
POSITIVE EDGE
Width
3.9 mm
7.62 mm
fmax-Min
1.5 MHz
1.5 MHz
Base Number Matches
1
3
Rohs Code
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