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MC1206P-2370-FBW vs RK73H2BXTD2370F feature comparison

MC1206P-2370-FBW RCD Components Inc

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RK73H2BXTD2370F KOA Speer Electronics Inc

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Rohs Code Yes Yes
Part Life Cycle Code Active Active
Ihs Manufacturer RCD COMPONENTS INC KOA SPEER ELECTRONICS INC
Reach Compliance Code compliant compliant
ECCN Code EAR99 EAR99
Construction Chip Chip
JESD-609 Code e3
Mounting Feature SURFACE MOUNT SURFACE MOUNT
Number of Terminals 2 2
Operating Temperature-Max 155 °C 155 °C
Operating Temperature-Min -55 °C -55 °C
Package Height 0.61 mm 0.6 mm
Package Length 3.2 mm 3.2 mm
Package Style SMT SMT
Package Width 1.55 mm 1.6 mm
Packing Method Bulk TR, PUNCHED PAPER, 7 INCH
Rated Power Dissipation (P) 0.25 W 0.25 W
Resistance 237 Ω 237 Ω
Resistor Type FIXED RESISTOR FIXED RESISTOR
Size Code 1206 1206
Surface Mount YES YES
Technology METAL GLAZE/THICK FILM METAL GLAZE/THICK FILM
Temperature Coefficient 100 ppm/°C 100 ppm/°C
Terminal Finish MATTE TIN OVER NICKEL
Terminal Shape WRAPAROUND WRAPAROUND
Tolerance 1% 1%
Working Voltage 200 V 200 V
Base Number Matches 1 1
Package Description CHIP
HTS Code 8533.21.00.30
Additional Feature PRECISION
Manufacturer Series RK73H
Package Shape RECTANGULAR PACKAGE
Rated Temperature 70 °C
Reference Standard AEC-Q200
Series RK73H
Resistors » Metal Glaze/Thick Film Resistors
Resistors » Metal Glaze/Thick Film Resistors

Compare MC1206P-2370-FBW with alternatives

Compare RK73H2BXTD2370F with alternatives