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MC1206P-2370-FBW vs MR12X2370FQL feature comparison

MC1206P-2370-FBW RCD Components Inc

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MR12X2370FQL Walsin Technology Corporation

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Rohs Code Yes Yes
Part Life Cycle Code Active Active
Ihs Manufacturer RCD COMPONENTS INC WALSIN TECHNOLOGY CORP
Reach Compliance Code compliant compliant
ECCN Code EAR99 EAR99
Construction Chip Chip
JESD-609 Code e3 e3
Mounting Feature SURFACE MOUNT SURFACE MOUNT
Number of Terminals 2 2
Operating Temperature-Max 155 °C 155 °C
Operating Temperature-Min -55 °C -55 °C
Package Height 0.61 mm 0.6 mm
Package Length 3.2 mm 3.1 mm
Package Style SMT SMT
Package Width 1.55 mm 1.6 mm
Packing Method Bulk TR, PAPER, 10 INCH
Rated Power Dissipation (P) 0.25 W 0.25 W
Resistance 237 Ω 237 Ω
Resistor Type FIXED RESISTOR FIXED RESISTOR
Size Code 1206 1206
Surface Mount YES YES
Technology METAL GLAZE/THICK FILM METAL GLAZE/THICK FILM
Temperature Coefficient 100 ppm/°C 100 ppm/°C
Terminal Finish MATTE TIN OVER NICKEL TIN
Terminal Shape WRAPAROUND WRAPAROUND
Tolerance 1% 1%
Working Voltage 200 V 200 V
Base Number Matches 1 1
Package Description CHIP
HTS Code 8533.21.00.30
Additional Feature ANTI-SULFUR, RATED AC VOLTAGE (V): 200
Rated Temperature 70 °C
Reference Standard AEC-Q200; MIL-STD-202
Resistors » Metal Glaze/Thick Film Resistors
Resistors » Metal Glaze/Thick Film Resistors

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