MC10H332L
vs
MC10H330P
feature comparison
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
ON SEMICONDUCTOR
|
ON SEMICONDUCTOR
|
| Part Package Code |
DIP
|
DIP
|
| Package Description |
CERAMIC, DIP-20
|
PLASTIC, DIP-24
|
| Pin Count |
20
|
24
|
| Reach Compliance Code |
not_compliant
|
not_compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Additional Feature |
WITH 4:1 OUTPUT MULTIPLEXERS
|
WITH 2-TO-1 OUTPUT MULTIPLEXER
|
| Family |
10H
|
10H
|
| JESD-30 Code |
R-CDIP-T20
|
R-PDIP-T24
|
| JESD-609 Code |
e0
|
e0
|
| Length |
24.515 mm
|
31.69 mm
|
| Logic IC Type |
BUS TRANSCEIVER
|
BUS TRANSCEIVER
|
| Number of Bits |
1
|
4
|
| Number of Functions |
2
|
1
|
| Number of Inputs |
4
|
|
| Number of Ports |
2
|
2
|
| Number of Terminals |
20
|
24
|
| Operating Temperature-Max |
75 °C
|
75 °C
|
| Operating Temperature-Min |
|
|
| Output Characteristics |
3-STATE
|
OPEN-EMITTER WITH CUT-OFF
|
| Output Polarity |
TRUE
|
TRUE
|
| Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
PLASTIC/EPOXY
|
| Package Code |
DIP
|
DIP
|
| Package Equivalence Code |
DIP20,.3
|
DIP24,.3
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
IN-LINE
|
| Prop. Delay@Nom-Sup |
4.5 ns
|
5.3 ns
|
| Propagation Delay (tpd) |
3 ns
|
2 ns
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
5.08 mm
|
4.44 mm
|
| Surface Mount |
NO
|
NO
|
| Technology |
ECL
|
ECL
|
| Temperature Grade |
COMMERCIAL EXTENDED
|
COMMERCIAL EXTENDED
|
| Terminal Finish |
TIN LEAD
|
TIN LEAD
|
| Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
| Terminal Pitch |
2.54 mm
|
2.54 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Width |
7.62 mm
|
7.62 mm
|
| Base Number Matches |
1
|
2
|
| Control Type |
|
INDEPENDENT CONTROL
|
| Count Direction |
|
UNIDIRECTIONAL
|
| Peak Reflow Temperature (Cel) |
|
235
|
| Power Supply Current-Max (ICC) |
|
157 mA
|
|
|
|
Compare MC10H332L with alternatives
Compare MC10H330P with alternatives