MC10H330P vs MC10H330FN feature comparison

MC10H330P onsemi

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MC10H330FN Motorola Mobility LLC

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Rohs Code No
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer ON SEMICONDUCTOR MOTOROLA INC
Part Package Code DIP QLCC
Package Description PLASTIC, DIP-24 QCCJ, LDCC28,.5SQ
Pin Count 24 28
Reach Compliance Code not_compliant unknown
HTS Code 8542.39.00.01 8542.39.00.01
Additional Feature WITH 2-TO-1 OUTPUT MULTIPLEXER 25 OHM LINE DRIVE CAPABILITY; 2:1 OUTPUT MULTIPLEXERS
Control Type INDEPENDENT CONTROL INDEPENDENT CONTROL
Count Direction UNIDIRECTIONAL UNIDIRECTIONAL
Family 10H 10H
JESD-30 Code R-PDIP-T24 S-PQCC-J28
JESD-609 Code e0 e0
Length 31.69 mm 11.5062 mm
Logic IC Type BUS TRANSCEIVER BUS TRANSCEIVER
Number of Bits 4 4
Number of Functions 1 1
Number of Ports 2 2
Number of Terminals 24 28
Operating Temperature-Max 75 °C 75 °C
Operating Temperature-Min
Output Characteristics OPEN-EMITTER WITH CUT-OFF OPEN-EMITTER WITH CUT-OFF
Output Polarity TRUE TRUE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP QCCJ
Package Equivalence Code DIP24,.3 LDCC28,.5SQ
Package Shape RECTANGULAR SQUARE
Package Style IN-LINE CHIP CARRIER
Peak Reflow Temperature (Cel) 235
Power Supply Current-Max (ICC) 157 mA 157 mA
Prop. Delay@Nom-Sup 5.3 ns 5.3 ns
Propagation Delay (tpd) 2 ns 2.4 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 4.44 mm 4.57 mm
Surface Mount NO YES
Technology ECL ECL
Temperature Grade COMMERCIAL EXTENDED COMMERCIAL EXTENDED
Terminal Finish TIN LEAD Tin/Lead (Sn/Pb)
Terminal Form THROUGH-HOLE J BEND
Terminal Pitch 2.54 mm 1.27 mm
Terminal Position DUAL QUAD
Width 7.62 mm 11.5062 mm
Base Number Matches 4 5

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