MC10H180FNR2
vs
MC10H181FNR2
feature comparison
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
MOTOROLA INC
|
ON SEMICONDUCTOR
|
| Part Package Code |
QLCC
|
QLCC
|
| Package Description |
QCCJ,
|
PLASTIC, LCC-28
|
| Pin Count |
20
|
28
|
| Reach Compliance Code |
unknown
|
not_compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Additional Feature |
FULL ADDER/SUBTRACTOR; PERMITS RIPPLE CARRY CASCADING; WITH COMPLEMENTARY OUTPUTS
|
|
| Family |
10H
|
10H
|
| JESD-30 Code |
S-PQCC-J20
|
S-PQCC-J28
|
| Length |
8.965 mm
|
11.505 mm
|
| Logic IC Type |
ADDER/SUBTRACTOR
|
ARITHMETIC LOGIC UNIT
|
| Number of Bits |
1
|
4
|
| Number of Functions |
2
|
1
|
| Number of Terminals |
20
|
28
|
| Operating Temperature-Max |
75 °C
|
75 °C
|
| Operating Temperature-Min |
|
|
| Output Characteristics |
OPEN-EMITTER
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
QCCJ
|
QCCJ
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
CHIP CARRIER
|
CHIP CARRIER
|
| Power Supply Current-Max (ICC) |
95 mA
|
|
| Propagation Delay (tpd) |
2.8 ns
|
4.5 ns
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
4.57 mm
|
4.57 mm
|
| Surface Mount |
YES
|
YES
|
| Technology |
ECL
|
ECL
|
| Temperature Grade |
COMMERCIAL EXTENDED
|
COMMERCIAL EXTENDED
|
| Terminal Form |
J BEND
|
J BEND
|
| Terminal Pitch |
1.27 mm
|
1.27 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Width |
8.965 mm
|
11.505 mm
|
| Base Number Matches |
1
|
1
|
| Rohs Code |
|
No
|
| JESD-609 Code |
|
e0
|
| Package Equivalence Code |
|
LDCC28,.5SQ
|
| Peak Reflow Temperature (Cel) |
|
235
|
| Terminal Finish |
|
TIN LEAD
|
|
|
|
Compare MC10H180FNR2 with alternatives
Compare MC10H181FNR2 with alternatives