MC10H181FNR2
vs
MC10H166P
feature comparison
| Part Life Cycle Code |
Transferred
|
Obsolete
|
| Ihs Manufacturer |
MOTOROLA INC
|
MOTOROLA SEMICONDUCTOR PRODUCTS
|
| Part Package Code |
QLCC
|
|
| Package Description |
QCCJ,
|
DIP, DIP16,.3
|
| Pin Count |
28
|
|
| Reach Compliance Code |
unknown
|
unknown
|
| HTS Code |
8542.39.00.01
|
|
| Additional Feature |
CAPABLE OF 16 LOGIC & ARITHMETIC OPERATIONS; INTERNAL RIPPLE CARRY; HIGHER ORDER LOOKAHEAD
|
|
| Family |
10H
|
|
| JESD-30 Code |
S-PQCC-J28
|
R-PDIP-T16
|
| Length |
11.505 mm
|
|
| Logic IC Type |
ARITHMETIC LOGIC UNIT
|
MAGNITUDE COMPARATOR
|
| Number of Bits |
4
|
|
| Number of Functions |
1
|
|
| Number of Terminals |
28
|
16
|
| Operating Temperature-Max |
75 °C
|
70 °C
|
| Operating Temperature-Min |
|
|
| Output Characteristics |
OPEN-EMITTER
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
QCCJ
|
DIP
|
| Package Shape |
SQUARE
|
RECTANGULAR
|
| Package Style |
CHIP CARRIER
|
IN-LINE
|
| Power Supply Current-Max (ICC) |
159 mA
|
|
| Propagation Delay (tpd) |
4.3 ns
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
4.57 mm
|
|
| Surface Mount |
YES
|
NO
|
| Technology |
ECL
|
ECL
|
| Temperature Grade |
COMMERCIAL EXTENDED
|
COMMERCIAL
|
| Terminal Form |
J BEND
|
THROUGH-HOLE
|
| Terminal Pitch |
1.27 mm
|
2.54 mm
|
| Terminal Position |
QUAD
|
DUAL
|
| Width |
11.505 mm
|
|
| Base Number Matches |
3
|
4
|
| Rohs Code |
|
No
|
| JESD-609 Code |
|
e0
|
| Package Equivalence Code |
|
DIP16,.3
|
| Power Supplies |
|
5 V
|
| Supply Voltage-Nom (Vsup) |
|
5 V
|
| Terminal Finish |
|
Tin/Lead (Sn/Pb)
|
|
|
|
Compare MC10H181FNR2 with alternatives