MC10H176FN vs MC10H135PG feature comparison

MC10H176FN Motorola Semiconductor Products

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MC10H135PG onsemi

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Rohs Code No Yes
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer MOTOROLA INC ONSEMI
Package Description PLASTIC, LCC-20 LEAD FREE, PLASTIC, DIP-16
Reach Compliance Code unknown compliant
HTS Code 8542.39.00.01 8542.39.00.01
Family 10H 10H
JESD-30 Code S-PQCC-J20 R-PDIP-T16
JESD-609 Code e0 e3
Length 8.9662 mm 19.175 mm
Logic IC Type D FLIP-FLOP JBAR-KBAR FLIP-FLOP
Max Frequency@Nom-Sup 250000000 Hz 250000000 Hz
Number of Bits 6 2
Number of Functions 1 1
Number of Terminals 20 16
Operating Temperature-Max 75 °C 75 °C
Operating Temperature-Min
Output Characteristics OPEN-EMITTER
Output Polarity TRUE COMPLEMENTARY
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code QCCJ DIP
Package Equivalence Code LDCC20,.4SQ DIP16,.3
Package Shape SQUARE RECTANGULAR
Package Style CHIP CARRIER IN-LINE
Power Supply Current-Max (ICC) 123 mA 75 mA
Propagation Delay (tpd) 2.4 ns 2.6 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 4.57 mm 4.44 mm
Surface Mount YES NO
Technology ECL ECL
Temperature Grade COMMERCIAL EXTENDED COMMERCIAL EXTENDED
Terminal Finish Tin/Lead (Sn/Pb) Tin (Sn)
Terminal Form J BEND THROUGH-HOLE
Terminal Pitch 1.27 mm 2.54 mm
Terminal Position QUAD DUAL
Trigger Type POSITIVE EDGE POSITIVE EDGE
Width 8.9662 mm 7.62 mm
fmax-Min 250 MHz 250 MHz
Base Number Matches 5 1
Pbfree Code Yes
Part Package Code DIP
Pin Count 16
Manufacturer Package Code 648-08
Factory Lead Time 4 Weeks
Packing Method RAIL
Peak Reflow Temperature (Cel) 260

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