MC10H135PG
vs
MC10135L
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Contact Manufacturer
Ihs Manufacturer
ONSEMI
ROCHESTER ELECTRONICS LLC
Part Package Code
DIP
DIP
Package Description
LEAD FREE, PLASTIC, DIP-16
CERAMIC, DIP-16
Pin Count
16
16
Manufacturer Package Code
648-08
Reach Compliance Code
compliant
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Factory Lead Time
4 Weeks
Family
10H
10K
JESD-30 Code
R-PDIP-T16
R-CDIP-T16
JESD-609 Code
e3
e0
Length
19.175 mm
19.495 mm
Logic IC Type
JBAR-KBAR FLIP-FLOP
JBAR-KBAR FLIP-FLOP
Max Frequency@Nom-Sup
250000000 Hz
Number of Bits
2
2
Number of Functions
1
1
Number of Terminals
16
16
Operating Temperature-Max
75 °C
85 °C
Operating Temperature-Min
-30 °C
Output Polarity
COMPLEMENTARY
COMPLEMENTARY
Package Body Material
PLASTIC/EPOXY
CERAMIC, METAL-SEALED COFIRED
Package Code
DIP
DIP
Package Equivalence Code
DIP16,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Packing Method
RAIL
Peak Reflow Temperature (Cel)
260
NOT SPECIFIED
Power Supply Current-Max (ICC)
75 mA
Propagation Delay (tpd)
2.6 ns
4.5 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
4.44 mm
5.08 mm
Surface Mount
NO
NO
Technology
ECL
ECL
Temperature Grade
COMMERCIAL EXTENDED
OTHER
Terminal Finish
Tin (Sn)
TIN LEAD
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Trigger Type
POSITIVE EDGE
POSITIVE EDGE
Width
7.62 mm
7.62 mm
fmax-Min
250 MHz
125 MHz
Base Number Matches
1
5
Output Characteristics
OPEN-EMITTER
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Compare MC10H135PG with alternatives
Compare MC10135L with alternatives