MC10H175FN
vs
M38510/06102BEX
feature comparison
| Rohs Code |
No
|
|
| Part Life Cycle Code |
Transferred
|
Active
|
| Ihs Manufacturer |
MOTOROLA INC
|
SRI INTERNATIONAL
|
| Package Description |
PLASTIC, LCC-20
|
DIP,
|
| Reach Compliance Code |
unknown
|
unknown
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Additional Feature |
WITH DUAL LATCH ENABLE; RESET ACTIVE ONLY WHEN LATCH ENABLE IS HIGH
|
|
| Family |
10H
|
10K
|
| JESD-30 Code |
S-PQCC-J20
|
R-GDIP-T16
|
| JESD-609 Code |
e0
|
|
| Length |
8.965 mm
|
|
| Logic IC Type |
D LATCH
|
D FLIP-FLOP
|
| Number of Bits |
5
|
1
|
| Number of Functions |
1
|
2
|
| Number of Terminals |
20
|
16
|
| Operating Temperature-Max |
75 °C
|
125 °C
|
| Operating Temperature-Min |
|
-55 °C
|
| Output Characteristics |
OPEN-EMITTER
|
|
| Output Polarity |
TRUE
|
COMPLEMENTARY
|
| Package Body Material |
PLASTIC/EPOXY
|
CERAMIC, GLASS-SEALED
|
| Package Code |
QCCJ
|
DIP
|
| Package Equivalence Code |
LDCC20,.4SQ
|
|
| Package Shape |
SQUARE
|
RECTANGULAR
|
| Package Style |
CHIP CARRIER
|
IN-LINE
|
| Power Supply Current-Max (ICC) |
107 mA
|
|
| Prop. Delay@Nom-Sup |
2.4 ns
|
|
| Propagation Delay (tpd) |
2.1 ns
|
3.9 ns
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
4.57 mm
|
|
| Surface Mount |
YES
|
NO
|
| Technology |
ECL
|
ECL
|
| Temperature Grade |
COMMERCIAL EXTENDED
|
MILITARY
|
| Terminal Finish |
Tin/Lead (Sn/Pb)
|
|
| Terminal Form |
J BEND
|
THROUGH-HOLE
|
| Terminal Pitch |
1.27 mm
|
|
| Terminal Position |
QUAD
|
DUAL
|
| Trigger Type |
LOW LEVEL
|
POSITIVE EDGE
|
| Width |
8.965 mm
|
|
| Base Number Matches |
5
|
6
|
| Part Package Code |
|
DIP
|
| Pin Count |
|
16
|
| fmax-Min |
|
200 MHz
|
|
|
|
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