MC10H158FNR2G
vs
MC10H159M
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
ONSEMI
|
ONSEMI
|
| Part Package Code |
QLCC
|
SOIC
|
| Package Description |
LEAD FREE, PLASTIC, LCC-20
|
EIAJ, SO-16
|
| Pin Count |
20
|
16
|
| Reach Compliance Code |
unknown
|
unknown
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Factory Lead Time |
4 Weeks
|
4 Weeks
|
| Family |
10H
|
10H
|
| JESD-30 Code |
S-PQCC-J20
|
R-PDSO-G16
|
| JESD-609 Code |
e3
|
e4
|
| Length |
8.965 mm
|
10.2 mm
|
| Logic IC Type |
MULTIPLEXER
|
MULTIPLEXER
|
| Number of Functions |
4
|
4
|
| Number of Inputs |
2
|
2
|
| Number of Outputs |
1
|
1
|
| Number of Terminals |
20
|
16
|
| Operating Temperature-Max |
75 °C
|
75 °C
|
| Operating Temperature-Min |
|
|
| Output Polarity |
TRUE
|
INVERTED
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
QCCJ
|
SOP
|
| Package Equivalence Code |
LDCC20,.4SQ
|
SOP16,.3
|
| Package Shape |
SQUARE
|
RECTANGULAR
|
| Package Style |
CHIP CARRIER
|
SMALL OUTLINE
|
| Packing Method |
TR
|
RAIL
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Power Supply Current-Max (ICC) |
53 mA
|
58 mA
|
| Prop. Delay@Nom-Sup |
2.9 ns
|
3.2 ns
|
| Propagation Delay (tpd) |
1.9 ns
|
2.2 ns
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
4.57 mm
|
2.05 mm
|
| Surface Mount |
YES
|
YES
|
| Technology |
ECL
|
ECL
|
| Temperature Grade |
COMMERCIAL EXTENDED
|
COMMERCIAL EXTENDED
|
| Terminal Finish |
TIN
|
NICKEL PALLADIUM GOLD
|
| Terminal Form |
J BEND
|
GULL WING
|
| Terminal Pitch |
1.27 mm
|
1.27 mm
|
| Terminal Position |
QUAD
|
DUAL
|
| Width |
8.965 mm
|
5.275 mm
|
| Base Number Matches |
1
|
4
|
| Moisture Sensitivity Level |
|
3
|
|
|
|
Compare MC10H158FNR2G with alternatives
Compare MC10H159M with alternatives