MC10H135PG
vs
MC10131FNR2
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
No
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
ONSEMI
|
MOTOROLA SEMICONDUCTOR PRODUCTS
|
| Part Package Code |
DIP
|
|
| Package Description |
LEAD FREE, PLASTIC, DIP-16
|
QCCJ, LDCC20,.4SQ
|
| Pin Count |
16
|
|
| Manufacturer Package Code |
648-08
|
|
| Reach Compliance Code |
compliant
|
unknown
|
| HTS Code |
8542.39.00.01
|
|
| Factory Lead Time |
4 Weeks
|
|
| Family |
10H
|
|
| JESD-30 Code |
R-PDIP-T16
|
S-PQCC-J20
|
| JESD-609 Code |
e3
|
e0
|
| Length |
19.175 mm
|
|
| Logic IC Type |
JBAR-KBAR FLIP-FLOP
|
D FLIP-FLOP
|
| Max Frequency@Nom-Sup |
250000000 Hz
|
125000000 Hz
|
| Number of Bits |
2
|
|
| Number of Functions |
1
|
2
|
| Number of Terminals |
16
|
20
|
| Operating Temperature-Max |
75 °C
|
85 °C
|
| Operating Temperature-Min |
|
-30 °C
|
| Output Polarity |
COMPLEMENTARY
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
DIP
|
QCCJ
|
| Package Equivalence Code |
DIP16,.3
|
LDCC20,.4SQ
|
| Package Shape |
RECTANGULAR
|
SQUARE
|
| Package Style |
IN-LINE
|
CHIP CARRIER
|
| Packing Method |
RAIL
|
TAPE AND REEL
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Power Supply Current-Max (ICC) |
75 mA
|
62 mA
|
| Propagation Delay (tpd) |
2.6 ns
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
4.44 mm
|
|
| Surface Mount |
NO
|
YES
|
| Technology |
ECL
|
ECL
|
| Temperature Grade |
COMMERCIAL EXTENDED
|
OTHER
|
| Terminal Finish |
Tin (Sn)
|
Tin/Lead (Sn/Pb)
|
| Terminal Form |
THROUGH-HOLE
|
J BEND
|
| Terminal Pitch |
2.54 mm
|
1.27 mm
|
| Terminal Position |
DUAL
|
QUAD
|
| Trigger Type |
POSITIVE EDGE
|
MASTER-SLAVE
|
| Width |
7.62 mm
|
|
| fmax-Min |
250 MHz
|
|
| Base Number Matches |
1
|
5
|
| Power Supplies |
|
-5.2 V
|
|
|
|
Compare MC10H135PG with alternatives