MC10H135FNR2G
vs
MC10H135P
feature comparison
Pbfree Code |
Yes
|
|
Rohs Code |
Yes
|
No
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
ONSEMI
|
ONSEMI
|
Part Package Code |
QFN
|
DIP
|
Package Description |
LEAD FREE, PLASTIC, LLC-20
|
PLASTIC, DIP-16
|
Pin Count |
20
|
16
|
Manufacturer Package Code |
775-02
|
|
Reach Compliance Code |
compliant
|
not_compliant
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Factory Lead Time |
4 Weeks
|
4 Weeks
|
Family |
10H
|
10H
|
JESD-30 Code |
S-PQCC-J20
|
R-PDIP-T16
|
JESD-609 Code |
e3
|
e0
|
Length |
8.965 mm
|
19.175 mm
|
Logic IC Type |
JBAR-KBAR FLIP-FLOP
|
JBAR-KBAR FLIP-FLOP
|
Max Frequency@Nom-Sup |
250000000 Hz
|
250000000 Hz
|
Moisture Sensitivity Level |
3
|
|
Number of Bits |
2
|
2
|
Number of Functions |
1
|
1
|
Number of Terminals |
20
|
16
|
Operating Temperature-Max |
75 °C
|
75 °C
|
Operating Temperature-Min |
|
|
Output Polarity |
COMPLEMENTARY
|
COMPLEMENTARY
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
QCCJ
|
DIP
|
Package Equivalence Code |
LDCC20,.4SQ
|
DIP16,.3
|
Package Shape |
SQUARE
|
RECTANGULAR
|
Package Style |
CHIP CARRIER
|
IN-LINE
|
Packing Method |
TR
|
RAIL
|
Peak Reflow Temperature (Cel) |
260
|
235
|
Power Supply Current-Max (ICC) |
75 mA
|
75 mA
|
Propagation Delay (tpd) |
2.6 ns
|
2.6 ns
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
4.57 mm
|
4.44 mm
|
Surface Mount |
YES
|
NO
|
Technology |
ECL
|
ECL
|
Temperature Grade |
COMMERCIAL EXTENDED
|
COMMERCIAL EXTENDED
|
Terminal Finish |
TIN
|
Tin/Lead (Sn80Pb20)
|
Terminal Form |
J BEND
|
THROUGH-HOLE
|
Terminal Pitch |
1.27 mm
|
2.54 mm
|
Terminal Position |
QUAD
|
DUAL
|
Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
Trigger Type |
POSITIVE EDGE
|
POSITIVE EDGE
|
Width |
8.965 mm
|
7.62 mm
|
fmax-Min |
250 MHz
|
250 MHz
|
Base Number Matches |
1
|
2
|
|
|
|
Compare MC10H135FNR2G with alternatives
Compare MC10H135P with alternatives